A complete suite of embeddable Wi-Fi IPs and platforms, spanning from Wi-Fi 4 to Wi-Fi 7
The Ceva-Waves Wi-Fi IP family is a comprehensive suite of IPs and platforms for embedding Wi-Fi...
Family of Highly Versatile Multi-protocol wireless platform IPs for enhanced connectivity in MCUs, SoCs, & Smart Edge
The Ceva-Waves Links family offers combinations of Ceva-Waves Wi-Fi, Ceva-Waves Bluetooth, 802.15.4 (supporting protocols such as Thread, Matter and Zigbee), and Ceva-Waves UWB hardware IP, integrated with Ceva or third-party radios and CPU- and OS-agnostic software stacks. New platforms will be introduced to address market trends or customers’ demands.
Links100
The Ceva-Waves Links100 is a low-power multi-protocol wireless connectivity IoT platform combining a cost-optimized Wi-Fi 6 1×1 40 MHz solution, a Bluetooth 5.4 dual-mode solution supporting LE and Classic Audio and numerous profiles, and an 802.15.4 solution for Zigbee, Thread and Matter compliance. These modules are pre-integrated with a single low-power 2.4 GHz radio implemented in TSMC 22 nm and their operation is orchestrated through smart coexistence mechanisms.
Links200
The Ceva-Waves Links200 is a fully integrated multi-protocol wireless platform in TSMC 12nm FFC+ supporting Bluetooth High Data Throughput and IEEE 802.15.4 for Zigbee, Thread and Matter compliance. It pre-integrates all the necessary hardware, software and radio components for a cost effective, low power and high-performance solution to enable the development of advanced smart edge AI SoC in an easy and fast time to market manner. Compliant with Bluetooth 6.0, Links200 supports a comprehensive feature set including Audio streaming (Classic Audio, LE Audio, Auracast Broadcast Audio) with High Data Throughput mode for next generation lossless multi-channel LE Audio streaming, Localization including AoA/AoD for Direction Finding and Channel Sounding for accurate and secure ranging, Low latency mode for gaming supporting up to 8KHz refresh rate.
Benefits
The Ceva-Waves Links IPs family simplify development and deployment of multi-protocol wireless connectivity by:
Supporting Broad range of use-cases - From power-efficient IoT to high-performance applications, addressing data transfer, security, localization and sensing with Bluetooth, 802.15.4, Wi-Fi and UWB
Enabling faster time to market - Substantially reduce engineering time
Reducing the risk - Building on decades of expertise in wireless communication silicon, software, radio integration and co-existence, and leveraging pre-certified connectivity IPs
Main Features
- Highly versatile multi-protocol wireless connectivity platform, leveraging the latest Ceva-Waves IPs, including Wi-Fi, Bluetooth, 802.15.4 (for Thread, Zigbee and Matter) and UWB
- Optimized co-existence schemes for each specific configuration
- Pre-integrated radio solutions, including RF from Ceva, various partners, and customer’s own in-house developments, addressing a wide range of configurations and foundry process nodes
- Hardware-accelerated embedded security modes and encryption to fully comply with the most demanding wireless standard specifications
- Complemented by Ceva’s extensive IP portfolio of Edge AI, audio, voice and sensing solutions
Block Diagrams
Ceva-Waves Links family
Ceva-Waves Links100
Ceva-Waves Links200
How Multi-Protocol Wireless Platforms Are Enabling The Next Wave Of Wireless Innovation
The wireless device market is evolving rapidly, driven by advances in multi-protocol connectivity technologies like Wi-Fi, Bluetooth®, 802.15.4, and UWB. These innovations are enabling groundbreaking applications across consumer, enterprise, and industrial sectors—enhancing performance, reducing power consumption, and delivering smarter, faster devices with unprecedented features like positioning and sensing.
